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Miller Brothers School of Engineering |
| Composite Materials Engineering Program | ||
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To serve society by developing creative engineering minds for the world of tomorrow! |
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CME Program - Alumni
Class of 2002 Listing
| Name | Employer/Graduate School |
| Anderson, Nathan | 3M, St. Paul, MN |
| Bauer, Zachary | |
| Bausman, Marvin | Coda Composites Company, Winona, MN |
| Bell, Joel | RTP Company, Winona, MN |
| Boe, Ryan | Fleetguard, Neillsville, WI |
| Drazkowski, Daniel | Michigan State University (Grad School), Lansing, MI |
| Loff (Fuller), Alison | University of Dayton Research Institute, Dayton, OH |
| Hawkinson, Neil | TRW Automotive Electronics, Winona, MN |
| Hoffman, Derek | Virginia Polytechnic Institute (Grad School), Blacksburg, VA |
| Kempen, Dale | Westfalia-Surge Technologies, Galesville, WI |
| Kendhammer, Joel | Peerless Chain, Winona, MN |
| Lichtblau, Damon | Federal Mogul, Lake City, MN |
| Loff, Andrew | Composite Advantage, Kettering, OH |
| Lukasek, Matthew | Technical Services for Electronics (TSE), Arlington, MN |
| Mesenberg, Shane | Dickten & Masch, Nashotah, WI |
| Ninas, Benjamin | PlastiCert, Lewiston, MN |
| Rollag, Christopher | Despatch Industries, Lakeville, MN |
| Schultz, Benjamin | Univ of Wisconsin - Milwaukee (Grad School), Milwaukee, WI |
| Simpson, Kelly | Advanced Component Technologies, Northwood, IA |
| Sterling, David | RTP Company, Winona, MN |
| Wilkins, Craig | Fleetguard, Neillsville, WI |
| Woodward, Lee | Wilson-Davis & Co., Inc. , Salt Lake City, UT |
| Xiong, Cheng | Ascus Technologies, Cleveland, OH |